Phone
+33176771298
Price
Conference Pass: €980 TTC
Age Suitability
None Specified
Dieline Summit Design packaging congress
Monday, Nov 17 6:00p
to
6:00p
Palais des Congrès de Paris
Paris,
IdF
Launched jointly by the international Emballage exhibition and The Dieline, the first edition of "The Dieline Summit" - will be held at the Palais des Congrès in Paris on the 16th and 17th November. This one-of-a-kind forum is inspired by the theme "What Is The Future Of Package Design?" It is aimed at professional designers, and packaging enthusiasts, aiming to reinvent packaging design in the presence of some of the sector’s leading stakeholders. URL:Tickets: http://atnd.it/16191-0
Created by Love Evvnt
Other Future Dates & Times
| Date | Time | Type | Tools |
|---|---|---|---|
| Sun, Nov 16 | 6:00p |
|
Location & Nearby Info
Show nearby:
0.1
mi
1
Le Sud Restaurant
0.9
mi
3
Restaurant First Avenue
1.7
mi
4
Niagara
2.1
mi
5
Restaurant L'Assemblée
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